Trion® T55 FPGAs
The T55 FPGA features the high-density, low-power Efinix® Quantum® fabric wrapped with an I/O interface in a small footprint package for easy integration. T55 FPGAs support mobile, consumer, and IoT edge markets that need low power, low cost, and a small form factor. These FPGAs have three hardened MIPI CSI-2 controllers with independent TX/RX. Additionally, they have hardened DDR DRAM controller that supports DDR3, LPDDR3, and LPDDR2. T55 FPGAs:
- Some packages have hardened MIPI CSI-2 interfaces for video and camera applications
- Feature a hardened DDR DRAM interface for accessing off-chip memory devices
- Have LVDS pins that operate at 800 Mbps per lane
- Are built on a low-power 40 nm process
- Feature high-performance I/O supporting 1.8, 2.5, and 3.3 V single-ended I/O standards and interfaces
- Provide flexible on-chip clocking
- Have device configuration options including a standard SPI and JTAG interfaces
- Fully supported by the Efinity® software, an RTL-to-bitstream compiler
Applications
Mobile, Consumer, IoT, Edge
Features
| Logic elements: | 54,195 |
| RAM (Kbits): | 2765.00 |
| RAM (blocks): | 540 |
| Multipliers (18 x 18): | 150 |
Documents
Available T55 FPGAs
| Ordering Code |
Package | Pins | GPIO | PLLs | Osc. | SPI Flash (Mbit) | LVDS TX |
LVDS RX |
MIPI TX |
MIPI RX |
DDR | Temp. Grade |
Speed Grade |
Where to Buy |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| T55F324C3 | FBGA | 324 | 130 | 7 | – | – | 20 | 26 | 2 | 2 | x8, x16 | C | 3 | DigiKey Find distributor |
| T55F324C4 | FBGA | 324 | 130 | 7 | – | – | 20 | 26 | 2 | 2 | x8, x16 | C | 4 | DigiKey Find distributor |
| T55F324I4 | FBGA | 324 | 130 | 7 | – | – | 20 | 26 | 2 | 2 | x8, x16 | I | 4 | DigiKey Find distributor |
| T55F484C3 | FBGA | 484 | 256 | 8 | – | – | 40 | 40 | – | – | x16, x32 | C | 3 | DigiKey Find distributor |
| T55F484C4 | FBGA | 484 | 256 | 8 | – | – | 40 | 40 | – | – | x16, x32 | C | 4 | DigiKey Find distributor |
| T55F484I4 | FBGA | 484 | 256 | 8 | – | – | 40 | 40 | – | – | x16, x32 | I | 4 | DigiKey Find distributor |
| T55F576C3 | FBGA | 576 | 278 | 8 | – | – | 52 | 52 | 3 | 3 | x16, x32 | C | 3 | DigiKey Find distributor |
| T55F576C4 | FBGA | 576 | 278 | 8 | – | – | 52 | 52 | 3 | 3 | x16, x32 | C | 4 | DigiKey Find distributor |
| T55F576I4 | FBGA | 576 | 278 | 8 | – | – | 52 | 52 | 3 | 3 | x16, x32 | I | 4 | DigiKey Find distributor |
Available Packages
T55 FPGA
BGA324
(12 x 12 mm, 0.65 pitch)
BGA484
(18 x 18 mm, 0.8 pitch)
BGA576
(16 x 16 mm, 0.65 pitch)
Use Cases
Smart Camera
This complicated, intelligent camera has multiple MIPI CSI-2 sensors. The FPGA provides image processing (as well as audio processing) and runs an inferencing engine based on a trained neural network defined by the implementer. Large amounts of internal block memory in the Trion FPGA allows you to keep much of the activity on chip. Additionally, the multiplier rich architecture provides additional of performance-power-area advantages.
Augmented Reality and Virtual Reality
Augmented reality and virtual reality products are smart devices that can benefit from FPGAs. Beyond entertainment, they can be useful for remote assistance and knowledge sharing. In these and similar applications, the performance advantage of Trion FPGAs is key. Additional driving factors are Trion FPGA’s small size and power. Our hardened MIPI CSI-2 functionality helps reduce power, and Trion FPGAs have a smaller chip area compared to other solutions.
