Trion® T55 FPGAs

Trion® T55 FPGAs

The T55 FPGA features the high-density, low-power Efinix® Quantum™ fabric wrapped with an I/O interface in a small footprint package for easy integration. T55 FPGAs support mobile, consumer, and IoT edge markets that need low power, low cost, and a small form factor. These FPGAs have three hardened MIPI CSI-2 controllers with independent TX/RX. Additionally, they have hardened DDR DRAM DDR DRAM controller that supports DDR3, LPDDR3, and LPDDR2. T55 FPGAs:

  • Some packages have hardened MIPI CSI-2 interfaces for video and camera applications
  • Feature a hardened DDR DRAM interface for accessing off-chip memory devices
  • Have LVDS pins that operate at 800 Mbps per lane
  • Are built on a low-power 40 nm process
  • Feature high-performance I/O supporting 1.8, 2.5, and 3.3 V single-ended I/O standards and interfaces
  • Provide flexible on-chip clocking
  • Have device configuration options including a standard SPI and JTAG interfaces
  • Fully supported by the Efinity® software, an RTL-to-bitstream compiler

Applications

Mobile, Consumer, IoT, Edge

Features

Logic elements: 54,195
RAM (bits): 2765.00
RAM (blocks): 540
Multipliers (18 x 18): 150

Documents

T55 Data Sheet

Trion Overview

Trion FPGA 製品概要

Trion Selector Guide

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Available T55 FPGAs

Ordering
Code
Package Pins GPIO PLLs Osc. LVDS
TX
LVDS
RX
MIPI
TX
MIPI
RX
DDR Temp.
Grade
Speed
Grade
Where to Buy
T55F324C3 FBGA 324 130 7 20 26 2 2 x8, x16 C 3 DigiKey
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T55F324C4 FBGA 324 130 7 20 26 2 2 x8, x16 C 4/4L DigiKey
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T55F324I4 FBGA 324 130 7 20 26 2 2 x8, x16 I 4/4L DigiKey
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T55F484C3 FBGA 484 256 8 40 40 x16, x32 C 3 DigiKey
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T55F484C4 FBGA 484 256 8 40 40 x16, x32 C 4/4L DigiKey
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T55F484I4 FBGA 484 256 8 40 40 x16, x32 I 4/4L DigiKey
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T55F576C3 FBGA 576 278 8 52 52 3 3 x16, x32 C 3 DigiKey
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T55F576C4 FBGA 576 278 8 52 52 3 3 x16, x32 C 4/4L DigiKey
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T55F576I4 FBGA 576 278 8 52 52 3 3 x16, x32 I 4/4L DigiKey
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Available Packages

T55 FPGA
T55

BGA324
BGA324 block diagram
(12 x 12 mm, 0.65 pitch)

BGA484
BGA484 block diagram
(18 x 18 mm, 0.8 pitch)

BGA576
BGA576 block diagram
(16 x 16 mm, 0.65 pitch)

Dimensions and blocks shown for illustrative purposes.

Use Cases

Smart Camera

This complicated, intelligent camera has multiple MIPI CSI-2 sensors. The FPGA provides image processing (as well as audio processing) and runs an inferencing engine based on a trained neural network defined by the implementer. Large amounts of internal block memory in the Trion FPGA allows you to keep much of the activity on chip. Additionally, the multiplier rich architecture provides additional of performance-power-area advantages.

Augmented Reality and Virtual Reality

Augmented reality and virtual reality products are smart devices that can benefit from FPGAs. Beyond entertainment, they can be useful for remote assistance and knowledge sharing. In these and similar applications, the performance advantage of Trion FPGAs is key. Additional driving factors are Trion FPGA’s small size and power. Our hardened MIPI CSI-2 functionality helps reduce power, and Trion FPGAs have a smaller chip area compared to other solutions.